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Senior Process Engineer

Kulicke & Soffa

Fort Washington, Pennsylvania
Job Type:
Job Status:
Full Time
1st Shift
Kulicke & Soffa
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Job Details

Kulicke and Soffa Industries, Inc., a leading manufacturer of semiconductor equipment, has an immediate opening for a Staff Process Engineer. The person will be responsible for developing advanced interconnect technologies for semiconductor device packaging.   This role encompasses 1) developing advanced packaging process solutions, usually in conjunction with one of our customers, 2) development and testing of advanced packaging assembly equipment and 3) research and development of improved and innovative interconnect technologies. 

The candidate should have a strong background in engineering or science directly related to advanced semiconductor packaging.  Strong aptitude in working with highly advanced mechatronic machinery is required. A candidate with experience and good understanding of current trends in semiconductor packaging is preferred. Strong preference will be given to candidates with existing experience in thermocompression or flip chip bonding. Strong communication skills are required.

Main Responsibilities:

  • Develop and optimize thermocompression or flip chip processes in collaboration with our customers

  • Serve as the lead technical interface to customers

  • Test and recommend improvements to advanced packaging assembly equipment

  • Detailed data analysis

  • Preparation of internal summary reports and customer presentations

  • Willingness to travel domestically and internationally about 15%, sometime more frequently



  • Strong aptitude and deep understanding of highly advanced machinery

  • Experience with flip chip, die attach or thermocompression bonding highly preferred

  • Strong data analysis skills, including working knowledge of Matlab and/or JMP, Minitab

  • Knowledge of MS Office suite, especially Excel and Power Point


Education Required:

  • Bachelors or Masters Degree (Masters preferred) in Mechanical or Electrical Engineering or in Materials science relevant to semiconductor packaging

  • 5 - 7 years of experience in semiconductor packaging


Interested candidates please submit resume and salary requirements to