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Process Engineer / Semiconductors / Dicing & Demount / Goleta, CA

Lockheed Martin

Goleta, CA
Job Code:
Lockheed Martin
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Job Details

The semiconductor process engineer is responsible for sustaining and supporting equipment and Focal Plane Array process areas including but not limited to dicing, demount, automated die cleaning and pick & place. This person will work with development and integration engineers to adapt new processes and techniques into the manufacturing line as required. Data driven analysis will be required to assess the efficacy of continuous improvement activities for the purposes of implementation. This person will also act as a capital owner and will be involved in acquisition through release to production activities.

Relocation: Relocation assistance is possible for this exciting position.
The Locale: Goleta is a city in southern Santa Barbara County, California. Goleta is part of the central coast region of California and offers lots of great scenery and is a great place to live and to raise a family. The region is known primarily for agriculture and tourism. Major crops include wine grapes, lettuce, strawberries, and artichokes. Goleta is known for being near the University of California, Santa Barbara campus, although the CDP of Isla Vista is closer. Much of Goleta is considered to be a quiet suburban community while Santa Barbara tends to attract most of the tourists and the area's residents. Goleta is about 8 miles west of the city of Santa Barbara, along the coast (the coast runs east to west in this portion of southern California). Where can you drive to from Goleta? Goleta is 2 hours northwest of Los Angeles. San Francisco is about 5 hours to the north of Goleta. Las Vegas, NV is about 5 hours to the northeast

Basic Qualifications
Bachelors degree from an accredited college in a related discipline or equivalent work experience. The position requires working knowledge of semiconductor manufacturing and metrology techniques. Experience in semiconductor processing, either in industry or a university environment. Must be proficient in MS Office (Word, Powerpoint, Excel). Must have excellent engineering documentation skills and communication skills. This facility requires special access and therefore all candidates must be a U.S. Citizen

Desired skills
Experience singulating silicon, glass, and compound semiconductor wafers. Experience with wet clean processes. Experience with automated die pick & place equipment. Microsoft Project, JMP or other data analysis software, and SPC software experience is desired. Ability to maintain engineering notebooks and the ability to interface effectively from the technician level to senior management. Willingness to help lead teams using project management techniques. Familiarity with DOE, risk assessment, and R/C analysis techniques. Lean Six Sigma training is also preferred but not required

As a leading technology innovation company, Lockheed Martin’s vast team works with partners around the world to bring proven performance to our customers’ toughest challenges. Lockheed Martin has employees based in many states throughout the U.S., and Internationally, with business locations in many nations and territories

Join us at Lockheed Martin, where we’re engineering a better tomorrow

Lockheed Martin is an Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, pregnancy, sexual orientation, gender identity, national origin, age, protected veteran status, or disability status

Job Location(s): Goleta California

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