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Mbr Engrg Staff

Lockheed Martin


Location:
Moorestown, NJ
Date:
03/31/2017
Job Code:
387775BR
Lockheed Martin
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Job Details

At Lockheed Martin Rotary and Mission Systems, we are driven by innovation and integrity. We believe that by applying the highest standards of business ethics and visionary thinking, everything is within our reach – and yours as a Lockheed Martin employee. Lockheed Martin values your skills, training and education. Come and experience your future!

- Responsible for the mechanical design of Radar system hardware including concept design, detailed design and analysis, design documentation, procurement support, manufacturing support, test support, environmental testing of electronic packages e.g. T/R Modules, Analog Modules and LRUs
- Responsible for low to medium level complexity microwave electronics packaging design of multi and/or single chip packages using chip and wire and//or other high density interconnect methods. Design of substrates using ceramic and/or laminate materials. Design of internal package interconnect methods and NHA interconnect methods
- Responsible for developing low to medium level complexity RF electronic packaging including TR Modules (chip and wire assemblies), RF Beamformers (L to Ku Band) and RF substrates with HTCC, LTCC, thick film and soft substrates
- Responsible for low to medium complexity thermal and stress finite element analysis
- Key member of the design team with good communication skills
- Responsible for providing program status and generating design review material in clear and concise presentations and/or documents for review by senior level engineers, management and customers.
- Use of engineering solid modeling tools to perform design tasks
- Highly self-motivated

Basic Qualifications
- BS in Mechanical Engineering with experience in the design and analysis of electronic equipment
- Ability to be a key member of the design team working with Microwave, MMIC, and T/R Module vendors. The individual should be focused on meeting program commitments while advancing the state-of-the-art electronic packaging capabilities
- Highly self-motivated
- Familiarity using 3D solid modeling tools (CREO preferred) to develop and iterate hardware designs
- Familiarity with finite element software (ANSYS preferred) to perform thermal and stress analyses
- Good verbal and written communication skills
- Ability to obtain & maintain a Secret Security Clearance

Desired skills
MS in Mechanical Engineering

As a leading technology innovation company, Lockheed Martin’s vast team works with partners around the world to bring proven performance to our customers’ toughest challenges. Lockheed Martin has employees based in many states throughout the U.S., and Internationally, with business locations in many nations and territories

Join us at Lockheed Martin, where we’re engineering a better tomorrow

Lockheed Martin is an Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, pregnancy, sexual orientation, gender identity, national origin, age, protected veteran status, or disability status

Job Location(s): Moorestown New Jersey

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