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Electromechanical Engineer 3/4

Northrop Grumman


Location:
Cincinnati, Ohio
Date:
08/25/2017
2017-08-252017-09-24
Job Type:
Employee
Job Status:
Full Time
Shift:
1st Shift
Categories:
  • Computer Engineering
  • Design/Development Engineering
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Job Details

Northrop Grumman in Cincinnaiti, OH has an Electromechanical Engineer position available for a BSME or MSME with mechanical design engineering experience in electronic packaging design. You will work as part of a multi-disciplinary product development team and duties will include package design from proposal support through analysis, development, qualification testing and transition to production.

Duties include:
• Lead Mechanical Design by designing 3-D Model of chassis, covers, digital and RF printed wiring board assemblies, heat sinks, internal and external cabling.
• Create all mechanical drawings (component, printed wiring board assembly, sub-assembly and final assembly drawings and parts lists).
• Interface with vendors to meet mechanical requirements to include thermal, vibration and structural requirements and analysis.
• Design hardware to meet MIL-STD 810.
• Experience with a 3D CAD tool(Solidworks) and MS Office
• Perform Finite Element Modeling(FEA) and, thermal and structural analysis (ANSYS)
• BSME
• Ability to obtain and maintain a Top Secret Security Clearance

We offer a competitive salary and benefits package. Please apply online at www.northropgrumman.com/careers and search req # 17019653.

Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit www.northropgrumman.com/EEO. U.S. Citizenship is required for most positions.



Requirements

The requisition may be filled at either a level 3 or level 4. 

Basic Qualifications for level 3: 
• BSME with 5 years of mechanical design engineering experience in electronic packaging design or a MSME with 3 years of mechanical design engineering experience in electronics packaging design
• Experience with a 3D CAD tool and MS Office
• Experience performing Finite Element Analysis(FEA) or, thermal and structural analysis(ANSYS)
• Ability to obtain and maintain a Top Secret Security Clearance is required.

Basic Qualifications for level 4: 
• BSME with 9 years of mechanical design engineering experience in electronic packaging design or a MSME with 7 years of mechanical design engineering experience in electronics packaging design
• Experience with a 3D CAD tool and MS Office
• Experience performing Finite Element Analysis(FEA) or, thermal and structural analysis(ANSYS)
• Ability to obtain and maintain a Top Secret Security Clearance is required 

Preferred Qualifications:
• Active Top Secret Security Clearance

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