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Back-end Semiconductor Process Engineer / Goleta, CA

Lockheed Martin

Goleta, CA
Job Code:
Lockheed Martin
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Job Details

Develops and controls processes for the Infrared Detector and Focal plane Array Manufacturing lines. Focus on flip-chip hybridization and underfill, diamond point turning, and chemical mechanical polishing. Other related processes to be interacted with include: photolithography, wet etching, plasma etching, metal deposition, and anti-reflective coating.
Specifies, introduces and qualifies new capital equipment. Works on sustaining and R&D projects. This is a role that requires leadership and excellent interpersonal skills (written & verbal communication, ability to articulate ideas and concepts, positive influencing skills and ability to work alone or as a part of a team)

Relocation: Relocation assistance is possible for this exciting position.
The Locale: Goleta is a city in southern Santa Barbara County, California. Goleta is part of the central coast region of California and offers lots of great scenery and is a great place to live and to raise a family. The region is known primarily for agriculture and tourism. Major crops include wine grapes, lettuce, strawberries, and artichokes. Goleta is known for being near the University of California, Santa Barbara campus, although the CDP of Isla Vista is closer. Much of Goleta is considered to be a quiet suburban community while Santa Barbara tends to attract most of the tourists and the area's residents. Goleta is about 8 miles west of the city of Santa Barbara, along the coast (the coast runs east to west in this portion of southern California). Where can you drive to from Goleta? Goleta is 2 hours northwest of Los Angeles. San Francisco is about 5 hours to the north of Goleta. Las Vegas, NV is about 5 hours to the northeast

Basic Qualifications
Bachelors degree from an accredited college in a related discipline or equivalent work experience. The position requires working knowledge of semiconductor manufacturing and metrology techniques. Experience in semiconductor processing, either in industry or a university environment. Must be proficient in MS Office (Word, Powerpoint, Excel). Must have excellent engineering documentation skills and communication skills. Must be a U.S. Citizen

Desired skills
Flip-chip bonding and underfill process experience. Diamond Point Turning or Chemical Mechanical Polish experience
Microsoft Project, JMP or other data analysis software, and SPC software experience is desired.
Ability to interface effectively from the technician level to senior management. Willingness to help lead teams using project management techniques. Familiarity with DOE, risk assessment, and R/C analysis techniques. Lean Six Sigma training is also preferred but not required

As a leading technology innovation company, Lockheed Martin’s vast team works with partners around the world to bring proven performance to our customers’ toughest challenges. Lockheed Martin has employees based in many states throughout the U.S., and Internationally, with business locations in many nations and territories

Join us at Lockheed Martin, where we’re engineering a better tomorrow

Lockheed Martin is an Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, pregnancy, sexual orientation, gender identity, national origin, age, protected veteran status, or disability status

Job Location(s): Goleta California

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